Wafer Level Chip Scale Packaging
Unlike traditional chip packaging methods—where the wafer is diced first and then packaged, typically increasing the final package size by at least 20% compared to the bare die—WLCSP represents an advanced technology in which packaging and testing are performed on the entire wafer prior to dicing. As a result, the final packaged footprint is identical to that of the original bare die.
Wafer Level Chip Scale Packaging
Unlike traditional chip packaging methods—where the wafer is diced first and then packaged, typically increasing the final package size by at least 20% compared to the bare die—WLCSP represents an advanced technology in which packaging and testing are performed on the entire wafer prior to dicing. As a result, the final packaged footprint is identical to that of the original bare die.
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